Technology Information

Nanosilicon anodic oxidation technology"e-COOL"
Entrusted joined and customized Manufacturing/Development
Bio / Medical application Electron emitting device
Luminescent silicon Crystalline silicon solar cell/Semiconductor process application

Crystalline silicon solar cell/Silicon wafer slicing technology

Potential of electrochemical slicing:

  1. Wafer thickness and kerfloss under 100 μm
  2. Mechanical damage free, no post processing required
  3. Scalable for industrial purpose, high throughput, automatic/continuous process, time and labor saving
  4. Compatible with current clean process for solar cells manufacture
  5. Recycling of the slicing by-products

[Side view of a silicon ingot]

NEDO contract research



"e-COOL" (Our technology)

e-COOL multi-wire slicer
Multi-wire saw (Conventional)
Multi-wire saw (Conventional)

Process available not only for slicing but also applicable to high efficiency and low cost solar cells manufacturing.
Application such as front surface anti-reflection and deep trench processing are under development.



Nanosilicon anodic oxidation technology"e-COOL"
Entrusted joined and customized Manufacturing/Development
Bio / Medical application Electron emitting device
Luminescent silicon Crystalline silicon solar cell/Semiconductor process application

TOP